Application No./Patent No.: 2016105373854 Application date: July May, 2016.
Inventor/Designer: Cao Yu, He An, Liu Wenwen, Zhang Jian, Sun Bingtao, Zhu Dehua, Jiang Xiaoxia.
The invention provides a laser smoothing and polishing method integrating measurement and processing, which comprises the following steps: clamping a workpiece; The two-dimensional laser displacement sensor is controlled to move in relative translation with the workpiece, and the coordinate matrix of uniform measuring points is obtained. Then control the scanning galvanometer system to scan the part of the workpiece surface to be polished once according to the set scanning speed, and obtain a new coordinate matrix of uniform measurement points of the part of the workpiece surface to be polished after laser scanning: calculate δ=Z(max)-Z(min), if δ is less than or equal to the target flatness of the workpiece, then finish; otherwise, construct a laser scanning network diagram of the workpiece surface, and give weight k to each grid in the laser scanning grid diagram; The galvanometer scanning system is controlled to scan each grid in the laser scanning grid graph for k times according to the weight k. According to the invention, the dynamic adjustment of process parameters is realized, and different process parameters are used at different stages, so that the thickness of materials removed by each laser scanning can be increased, the flattening speed is accelerated, and the processing efficiency and the processing precision are improved.
